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It can perform processes such as removal of residue in holes, surface cleaning, roughening, and activation
Application Areas
PI Surface Roughening and Cleaning
PCB Desmear and Surface Cleaning
FPC Desmear and Surface Cleaning
Surface Roughening and Cleaning of Electronic Materials
Surface Roughening and Cleaning of COVERLY
Product Features
Special Gas Inlet, Diffusion, and Exhaust System Design
Provides excellent processing uniformity and consistent results
Supports various gases
Fully automatic, simple and easy to operate, with high stability and easy maintenance
Special specification machine can be customized according to customer's requirements
Specification
Machine Dimensions (LWH) | 3058*4340*2409mm |
Vacuum | ≤1pa( At standard atmospheric pressure) |
Processing thickness range | 0.1-10.0mm |
Processable size | Max: 48" × 29" (1220 mm × 736 mm) Min: 4" × 4" (100 mm × 100 mm) |
Max. layers | 15 layers (13/18/20 layers customizable) |
Gas direction | Top to bottom |
Types of gas | N2、O2、CF4、H2 |
Output frequency | 40KHz |
Output power | 10Kw |
Uniformity | ≥80% |
Noise | (Normal operation):≤70dB |
Control panel | Mouse, keyboard & touchscreen operation |
Protection device | Emergency stop device |
Loading method | Manual loading + material cart transport |
Failure rate | ≤1/400h(failure time / equipment operating time) |
Console height | 900±100mm |
Production Requirements | ① Pretreatment of incoming materials ② Set pre-baking temperature and time based on the Tg value of the board |
Communal Requirement
Electrical requirements | ||
Electric | Three-phase five-wire 380V | |
Pressure of compressed air | ≧ 6.5bar | |
Power (output) | 30KW | |
With pump station exhaust port | KF40 | |
Compressed air consumption | 6m³/h（interfaces：φ12mm） | |
Recommended space around machine | 800mm | |
Weight of machine | 3200KG | |
Ice-wate | 35 L/min at 20°C (water pressure: 4 kg) | |
Equipment installation environment (temperature, humidity, and cleanliness requirements) | A. Environmental requirements: clean room, 100,000 level ↑ . B. Temperature requirement: 22±2℃ . C. Humidity requirements: 50±5% | |
Process gas | Purity: 99.999% | |
