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This machine is designed for conductive/non-conductive resin hole plugging processes, ensuring full filling without depressions or bubbles. It is suitable for selective through-holes, blind vias, back-drilled holes, and other plugging applications. Compatible with silver resin, copper resin, conductive adhesives, as well as domestic and imported resin.
Features
Selective via hole filling of through holes and blind vias
Complete solutions for the air bubble and cavity defects in High AR panels
The operating interface is automated, user-friendly and easy to operate
Product Specifications
Model | VAPM6171 | VAPM6191 | |
Production thickness | 0.2-8.0 mm | 0.2-8.0 mm | |
Printable area | 24” *28 ” (610*710mm） | MAX:24 ”*36” (610*910mm） | |
Registration Method | Manual (CCD Positioning - Optional) | ||
Plugging speed: 2-350mm/s（Digitally Adjustable Settings） | Plugging pressure: 1-250kgf（Digitally Adjustable Settings） | ||
Squeegee Adjustment Angle:±15° Table flatness:±0.05mm | Scraper adjustment distance: 0-40mm（Digitally Adjustable Settings） | ||
Table Fine-Adjustment Precision： X andY directions: ±5mm | Screen lifting:0-350mm（Screen Up/Down: 0-350mm (Digitally Controlled) | ||
Thickness of frame:25-45mm | Stencil fixing method: 10-Point Air Pressure Lock | ||
Squeegeeing Stroke | 0-780mm（Digital Setting） | 0-1000mm（Digital Setting） | |
Scratch Printing Method | Single Squeegee Overprinting | ||
Squeegee direction | Facing the operation panel, the squeegee prints from front to back. | ||
Clearance | 0-30mm（Digitally Adjustable Settings） | ||
Mesh frame dimensions | Min：900*900MAX：1100*1100mm | MAX：1300*1300mm | |
Transformation number, material number time | ≤ 15min（Skilled Worker） | ||
Countertop Dimensions | 900*900mm | 900*1100mm | |
Plugging Hole Types | Horizontal selection or full-board via filling | ||
Machine Dimensions（L×W×H) | L3497*W1794*H2185mm（Main unit dimensions, including slide rail, excluding tower light ) L3497*W3511*H2185mm(Main unit + Vacuum pump assembly) （Appearance and dimensions are subject to change based on design requirements. The actual product shall prevail.） | L3617*W1994*H2186mm （Main unit dimensions, including slide rail, excluding tower light ) L3617*W3711*H2186mm( Main unit + Vacuum pump assembly) （Appearance and dimensions are subject to change based on design requirements. The actual product shall prevail.） | |
Weight | Main unit: 4,500 kg Vacuum pump assembly: 500 kg | Main unit: 5,500 kg Vacuum pump assembly: 500 kg | |
Scope of use | Through-hole/Blind via/Back-drilled hole filling | ||
Filled hole diameter range (through-hole, blind via, back drill) | Through-hole: 0.1-1.0mm (pre-plating hole diameter) Blind via: 0.1-0.5mm (pre-plating hole diameter) Back-drilled hole: 0.15-1.0mm (pre-plating hole diameter) | ||
Plugging hole aspect ratio | Through-hole: Aspect ratio 30:1 （Multiple passes or opposing plug methods are allowed）| Blind via: Aspect ratio 3:1(Finished hole diameter after plating: 0.05mm) | ||
Difference in aperture size between plates of the same type | ≦ 0.2mm（ Simultaneous operation of large and small holes） | ||
Edge-to-hole spacing (for filled vs. unfilled vias) | ≥ 0.3mm (Aspect ratio: 10:1) | ||
Noise (normal operation): ≤ 75dB | Operator Interface::HMI | ||
Operating Vacuum Level::40-120pa | Ultimate Vacuum:10pa | ||
Plugging effects: Bubble-free | Alignment method: Automatic (precision: 0.01mm) | ||
Safety protection：Emergency stop switch, Warning lights (red, yellow,green), Buzzer, Safety light curtain | Plugging material: Resin Copper paste Silver paste | ||
Resin Waste Costs | Except for the paste adhered to the stencil and incompletely scraped paste, all other paste can be used for via filling | ||
Automatic Alarms: Flashing lights and buzzer alarm | Printing with screen lift function:0-30mm | ||
Automatic screen mesh cleaning | The cleaning frequency can be set according to production requirements. | ||
Auto resin feeding system | Resin can be added according to production requirements. | ||
