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Specifically designed for removing the residual resin after plugging.
Descriptions
Designed for removing the residual grinding of PCB boards after grinding, using vacuum adsorption technology to fix the PCB board on the table, manually pull the grinding head to a specific position and drive it to rotate in order to partially grind the PCB board.
Features
Grinding area (size) and precision can be switched quickly.
Easy switching between dry/wet grinding modes.
Replace the traditional manual grinding, accurate control of copper thickness accuracy.
The grinding current is accurately displayed on a high precision digital ammeter.
Specifications
Equipment Size | 1600*1432*2100mm |
Panel Size | Min: 12*14I n(304.8*356mm) Max: 21*30In(536*762mm) |
Panel Thickness | 0.3-15mm |
Grinding accuracy | 0.25mil（MAX） |
Rotate Speed | 1000/1500/2000rpm |
Working Height | 1350±50mm（Compatible with foot pedal） |
Make-up pipe calibre | 20mm（4-point pipe） |
Communal Requirement
Electricity needs | |
Electronic | AC380V;3P+N+PE,50Hz |
Power (output) | 5KW |
Required amount of air pressure | ≥ 0.6MPa;φ6mm(dry air） |
Recommended space around machine | 800mm |
Weight | 900KG |
Equipment installation environment (temperature, humidity and dust-free requirements) | Clean room Temperature requirement: 22±2℃ Humidity requirement: 50±5% |
